WUXI WANLI ADHESION MATERIALS CO., LTD.
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New Hot Selling Bulk Transparent Chips EVA Hotmelt WANLI® C-23 with Viscosity 4500±500mpa·s (160℃) for Book Cover Bonding with Coated Paper Weight ≤300G/m²
Wanli® EVA hot melt adhesive C-23 for book cover bonding is a ethylene-vinyl acetate copolymer with 100% solid content. C-23 is specifically developed for book wireless binding. C-23 is featured high bonding strength, fast curing, suitable for automatic hot melt glue binding book production line.
APPLICATION
Wanli® EVA hot melt adhesive C-23 is used for book cover wireless bonding. C-23 is suitable for paper with a weight of ≤300G/m².
| Application Material | Book Cover Binding Adhesives |
| Appearance | Transparent Flaky Solid |
| Component | EVA |
| Application Industry | Book Front Cover Binding Adhesives |
| Solid Content | 100% |
| Operating Temperature | 150℃～160℃ |
| Softening Temperature | 75±5 ℃ |
| Melt Viscosity | 4500±500mpa·s (160℃) |
| Curing | Normal Temperature Curing |
| Usage Scope | For Paper With A Weight Of ≤300G/m² |
| Shelf Life | 2 Years |
| Package | 25Kg/Bag |
FEATURE
Perfect bonding strength.
Fast curing.
Suitable for automatic hot melt glue binding book production line.
USER GUIDE
The package of C-23 is suitable for various dispensing equipment.
The recommended operating temperature is 150℃~160℃, which depends on the equipment, substrate and environment and other conditions.
STORAGE
Store up the product C-23 at cool & dry area and avoid direct sunlight. The storage temperature should be not more than 35℃ and away from open fire or heat source.
