WUXI WANLI ADHESION MATERIALS CO., LTD.
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China Factory Supply Yellow & Solid Reactive Hot Melt Adhesive WANLI® PUR-XBB719 with Viscosity About 5000cps@160℃(Brookfield-ASTMD3236) for Flat Lamination Bonding of Metal Plates, Plastics, Paper Products, Wood-Plastic Boards, Medium Density Boards, etc.
Wanli® PUR hot melt adhesive PUR-XBB719 for flat lamination bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB719 can be used for flat lamination bonding of metal plates, plastics, paper products, wood-plastic boards, medium density boards, etc. PUR-XBB719 is featured stable viscosity under heating at a certain temperature, very high initial bonding strength and final strength. After curing, PUR-XBB719 has good peel strength, good heat and humidity resistance and chemical resistance.
APPLICATION
Wanli® PUR hot melt adhesive PUR-XBB719 is used for flat lamination bonding. PUR-XBB719 is mainly used for flat lamination bonding of metal plates, plastics, paper products, wood-plastic boards, medium density boards, etc.
| Application Material | Woodworking Flat Lamination Hot Melt Adhesives |
| Appearance | Yellow Solid |
| Component | PUR (Polyurethane) |
| Application Industry | Woodworking Flat Lamination Bonding |
| Solid Content | 100% |
| Operating Temperature | 150±10℃( Depend On Machine, Substrate, Environment And Other Conditions) |
| Melt Viscosity | Approximate 5000cps@160℃(Brookfield-ASTMD3236) |
| Open Time | About 4 Minutes @25℃ |
| Usage Scope | Flat Lamination Bonding of Metal, Paper, Wood-plastic MDF etc. |
| Shelf Life | 6 Months |
| Package | 2Kg/Bag, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
Stable viscosity under heating at a certain temperature.
Very high initial bonding strength and final strength.
PUR-XBB719 has good peel strength, good heat and humidity resistance and chemical resistance after curing.
USER GUIDE
The package of PUR-XBB719 is suitable for various dispensing equipment.
The recommended operating temperature is 140℃~160℃.
It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity) to achieve complete curing.
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.
