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Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A

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Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A

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Brand Name :WANLI-ADHESION
Model Number :PUR-7563A
Certification :ISO9001 ISO14001 IATF16949
Place of Origin :CHINA
MOQ :20 KG
Payment Terms :L/C, T/T
Delivery Time :5-8 work days
Packaging Details :500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel
Product :PUR Hot Melt Adhesive
Component :PUR (Polyurethane)
Appearance :White Solid
Solid Content :100%
Shelf Life :6 Months
Melt Viscosity :About 65000cps@120℃
Operating Temperature :120~140 ℃
Open Time :About 10s@25℃
Useage Scope :Edge Bonding of Wood Material s- Chip Board
Application Industry :Woodworking Edgebanding
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Polyurethane hot melt glue PUR-7563A can be used for a broad spectrum of adhesion to different edgeband materials. Fast adhesive setting for direct downline processing and high heat resistance and durability. Wanli supplies these hot melt adhesives of the latest generation also in granulate form. The ease of processing makes them particularly attractive for processers who have not used the PUR technology before


Wanli® PUR hot melt adhesive PUR-7563A for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-7563A is a cleaning free glue, which is mainly used for edge bonding of solid wood materials, MDF, foam boards and other substrates. PUR-7563A is featured stable viscosity under heating at a certain temperature, short open time, high initial bonding strength, high final bonding strength and no cleaning.

APPLICATION
Wanli® PUR hot melt adhesive PUR-7563A is used for edge bonding. PUR-7563A is mainly used for edge bonding of solid wood materials, MDF, foam boards and other substrates.

Application Material Woodworking Edgebanding Hot Melt Adhesives
Appearance White Solid
Component PUR (Polyurethane)
Application Industry Woodworking Edgebanding
Solid Content 100%
Operating Temperature 120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt Viscosity About 65000cps@120℃(Brookfield-ASTMD3236)
Open Time About 10s@25℃
Usage Scope Edge Bonding of Wood Materials - Chip Board
Shelf Life 6 Months
Package 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel


FEATURE
Stable viscosity under heating at a certain temperature.
Short open time.
High initial bonding strength.
High final bonding strength and no cleaning.

USER GUIDE
The package of PUR-7563A is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity to achieve complete curing (recommended temperature: 23~25℃, about 65% relative humidity).

STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.

Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A

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