WUXI WANLI ADHESION MATERIALS CO., LTD.
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Hot Sale Factory Direct Bulk Light Yellow Chips EVA Hotmelt WANLI® C-21 with Viscosity 4800±800mpa·s (130℃) for Book Cover Bonding at Paper Weight ≤200G/m²
Wanli® EVA hotmelt adhesive C-21 for book cover bonding is a ethylene-vinyl acetate copolymer with 100% solid content. C-21 is specifically developed for book wireless binding. C-21 is featured high bonding strength, fast curing, suitable for automatic hotmelt glue binding book production line.
APPLICATION
Wanli® EVA hotmelt adhesive C-21 is used for book cover wireless bonding. C-21 is suitable for paper with a weight of ≤200G/m².
| Application Material | Book Cover Binding Hot Melt Adhesives |
| Appearance | Light Yellow Chips |
| Component | EVA |
| Application Industry | Hot Melt Adhesives for Book Cover Binding |
| Solid Content | 100% |
| Operating Temperature | 130～150 ℃( Depend On Substrate, Environment, Equipment And Other Conditions) |
| Softening Temperature | 72±5 ℃ |
| Melt Viscosity | 4800±800mpa·s (130℃) |
| Usage Scope | For Paper With A Weight Of ≤200G/m² |
| Shelf Life | 2 Years |
| Package | 25Kg/Bag |
FEATURE
Fast curing.
Low cost.
Good bonding strength.
Suitable for automatic hot melt glue binding book production line.
USER GUIDE
The package of C-21 is suitable for various dispensing equipment.
The recommended operating temperature is 130~150℃, which depends on the equipment, substrate and environment and other conditions.
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.
